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Thermal Pad
Thermal Gap Filler Pad is design to be used in the applications that require the minimum amount of pressure on components and high thermal conductivity. Jones Thermal Gap Filler Pad is very conformable, filled silicone rubber material and has 1.7-7.0 w/m-k conductivity grades; it is easy to fill in air gaps between PC board and heat sinks or a metal chassis.
Jones Thermal Gap Filler Pad is naturally tacky, requiring no adhesive coating to inhabit thermal performance. It can also be with specific coating becoming single side tacky to allow easy material handling and installation.
Features and Advantages
● High thermal conductivity
● Nature tacky or no sticky on carrier side
● RoHS Compliance
● 211 series offer high hardness for special application.
● 212 series offer low thermal contact resistance with various thermal conductivity
● 218 series offer ultra low stress at over 50% deflection.
● All products are available on fiber glass carrier with suffix F and single side tacky with suffix A
Applications
Cooling components to chassis, frame, or other         mating components    Memory modules Home and small office network equipment
Mass storage devices Automotive electronics Telecommunication hardware
Radios LED solid state lighting Power electronics
LCD and PDP flat panel Set top boxes Audio and video component
IT infrastructure
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