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Phase Change Materials
Phase change material is designed to maximize heat sink performance and improve component reliability. Thermal Phase Change Material completely fills interfacial air gaps and voids. It also displaces entrapped air between power dissipating electronic components. At room temperature, PCM is solid and easy to handle. This allows it to be consistently and cleanly applied as dry pad to a heat sink or component surface. Upon reaching its melting temperature of 52 °C, it begins to soften and flow, filling the microscopic irregularities of the component it comes into contact with. The result is an interface with minimal bond‐line thickness and thermal contact resistance. It can be supplied as sheets, rolls and custom die‐cut configurations.
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